The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2011

Filed:

Feb. 25, 2010
Applicants:

Hozumi Yasuda, Ohta-ku, JP;

Keisuke Namiki, Ohta-ku, JP;

Makoto Fukushima, Ohta-ku, JP;

Osamu Nabeya, Ohta-ku, JP;

Koji Saito, Ohta-ku, JP;

Satoru Yamaki, Ohta-ku, JP;

Tomoshi Inoue, Ohta-ku, JP;

Shingo Togashi, Ohta-ku, JP;

Tetsuji Togawa, Ohta-ku, JP;

Inventors:

Hozumi Yasuda, Ohta-ku, JP;

Keisuke Namiki, Ohta-ku, JP;

Makoto Fukushima, Ohta-ku, JP;

Osamu Nabeya, Ohta-ku, JP;

Koji Saito, Ohta-ku, JP;

Satoru Yamaki, Ohta-ku, JP;

Tomoshi Inoue, Ohta-ku, JP;

Shingo Togashi, Ohta-ku, JP;

Tetsuji Togawa, Ohta-ku, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...

Find Patent Forward Citations

Yasuda, Hozumi. (2011). Elastic membrane for semiconductor wafer polishing apparatus (U.S. Patent No. D634719). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/D634719

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