The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Mar. 30, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Keisuke Namiki, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Makoto Fukushima, Tokyo, JP;

Shingo Togashi, Tokyo, JP;

Satoru Yamaki, Tokyo, JP;

Shintaro Isono, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/32 (2012.01); B24B 37/34 (2012.01); B24B 49/00 (2012.01); B24B 49/10 (2006.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/32 (2013.01); B24B 37/345 (2013.01); B24B 49/003 (2013.01); B24B 49/105 (2013.01); B24B 49/12 (2013.01);
Abstract

A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.


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