Tokyo, Japan

Shintaro Isono

USPTO Granted Patents = 5 

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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5 patents (USPTO):

Title: Shintaro Isono: Innovator in Substrate Polishing Technology

Introduction

Shintaro Isono is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate polishing technology, holding a total of five patents. His innovative approaches have advanced the efficiency and effectiveness of polishing methods used in various industries.

Latest Patents

Isono's latest patents include a substrate polishing method and a polishing apparatus. The substrate polishing method involves conveying a substrate to a position above a polishing pad using an elastic film. This method allows for effective polishing while ensuring the substrate is lifted off without complications. His polishing apparatus is designed to prevent the polishing object from slipping out, regardless of the process type or polishing conditions. It features a pressing unit that applies pressure to the back surface of the polishing object, ensuring a secure and effective polishing process.

Career Highlights

Shintaro Isono is currently employed at Ebara Corporation, a leading company in the field of fluid machinery and environmental engineering. His work at Ebara has allowed him to focus on developing advanced polishing technologies that cater to the needs of various industries.

Collaborations

Isono has collaborated with notable colleagues such as Makoto Fukushima and Hozumi Yasuda. Their combined expertise has contributed to the successful development of innovative polishing solutions.

Conclusion

Shintaro Isono's contributions to substrate polishing technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in polishing processes, making him a valuable asset in his field.

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