The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Mar. 14, 2017
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Shintaro Isono, Tokyo, JP;
Hozumi Yasuda, Tokyo, JP;
Keisuke Namiki, Tokyo, JP;
Osamu Nabeya, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
Shingo Togashi, Tokyo, JP;
Satoru Yamaki, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 37/32 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); B24B 37/20 (2013.01); B24B 37/32 (2013.01);
Abstract
According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.