Ebara Corporation

Shintaro Isono

Osamu Nabeya

Makoto Fukushima

Hozumi Yasuda

Keisuke Namiki

Shingo Togashi

Satoru Yamaki

According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.

Substrate polishing method, top ring, and substrate polishing apparatus

A polishing object is prevented from slipping out without depending on the process type or the polishing condition. A polishing apparatus for polishing a surface to be polished of an polishing object by sliding the surface to be polished and a polishing member relative to each other, including: a pressing unit that presses a back surface of the surface to be polished of the polishing object such that the surface to be polished is pressed against the polishing member; a retainer member that is arranged on an outer side of the pressing unit and presses the polishing member; a storage unit that stores information concerning a condition for preventing the polishing object from slipping out, the condition being defined by use of information concerning a pressing force of the retainer member; and a control unit that acquires information concerning a force of friction between the surface to be polished of the polishing object and the polishing member or information concerning the pressing force of the retainer member, and executes control for adapting to the condition for preventing the slipping-out by using the acquired information concerning the force of friction or the acquired information concerning the pressing force of the retainer member.

Polishing apparatus, control method and recording medium

An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

Elastic membrane, substrate holding apparatus, and polishing apparatus

A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.

Growing community of inventors

Tokyo, Japan

Shintaro Isono