The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
May. 22, 2013
Kla-tencor Corporation, San Jose, CA (US);
Lu Chen, Sunnyvale, CA (US);
Jason Kirkwood, Santa Clara, CA (US);
Mohan Mahadevan, Livermore, CA (US);
James A. Smith, Los Altos, CA (US);
Lisheng Gao, Morgan Hill, CA (US);
Junqing (Jenny) Huang, Fremont, CA (US);
Tao Luo, Fremont, CA (US);
Richard Wallingford, San Jose, CA (US);
KLA-Tencor Corp., San Jose, CA (US);
Abstract
Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.