The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Feb. 23, 2016
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Brandon P. Wirz, Kuna, ID (US);

Keith Ypma, Boise, ID (US);

Christopher J. Gambee, Caldwell, ID (US);

Jaspreet S. Gandhi, Boise, ID (US);

Kevin M. Dowdle, Pocatello, ID (US);

Irina Vasilyeva, Boise, ID (US);

Yang Chao, Boise, ID (US);

Jon Hacker, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 23/48 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/0274 (2013.01); H01L 21/31111 (2013.01); H01L 21/6836 (2013.01); H01L 21/76843 (2013.01); H01L 21/76871 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54473 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.


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