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For the Inventor, By the Inventor

Caldwell, ID, United States of America

Christopher J Gambee

USPTO Granted Patents = 24

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 41(Granted Patents)


Company Filing History:

goldMedal24 out of 37,905 
 
Micron Technology Incorporated
 patents

Years Active: 2008-2022

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24 patents (USPTO):Explore Patents
1. 11302653 - Die features for self-alignment during die bonding (2022-04-12),
2. 11276658 - Devices with three-dimensional structures and support elements to increase adhesion to substrates (2022-03-15),
3. 11094684 - Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography (2021-08-17),
4. 10923478 - Reduction of roughness on a sidewall of an opening (2021-02-16),
5. 10896886 - Semiconductor devices having discretely located passivation material, and associated systems and methods (2021-01-19),
6. 10811313 - Methods of fabricating conductive traces and resulting structures (2020-10-20),
7. 10790251 - Methods for enhancing adhesion of three-dimensional structures to substrates (2020-09-29),
8. 10748857 - Die features for self-alignment during die bonding (2020-08-18),
9. 10403618 - Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography (2019-09-03),
10. 10332792 - Methods of fabricating conductive traces and resulting structures (2019-06-25),
11. 10262961 - Semiconductor devices having discretely located passivation material, and associated systems and methods (2019-04-16),
12. 10002840 - Semiconductor devices having discretely located passivation material, and associated systems and methods (2018-06-19),
13. 9966347 - Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods (2018-05-08),
14. 9741612 - Semiconductor devices and methods for backside photo alignment (2017-08-22),
15. 9704781 - Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods (2017-07-11),

Title: The Innovative Journey of Christopher J Gambee

Introduction: Christopher J Gambee, a talented inventor hailing from Caldwell, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Christopher J Gambee holds several patents in various fields, showcasing his versatility and ingenuity in inventing new solutions to existing challenges.

Career Highlights: Throughout his career, Christopher J Gambee has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions to fill those voids. His passion for innovation has led to the successful commercialization of several of his inventions, making a positive impact on industries and consumers alike.

Collaborations: Christopher J Gambee has collaborated with leading research institutions, universities, and companies to further enhance his inventions and bring them to the market. His collaborative spirit and willingness to work with others have been instrumental in the success of his projects.

Conclusion: Christopher J Gambee's journey as an inventor is a testament to his unwavering commitment to pushing the boundaries of what is possible through innovation. His passion for creating solutions to real-world problems continues to inspire others in the field, making him a true pioneer in the world of inventions.

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