The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Dec. 28, 2015
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chen-Shien Chen, Hsinchu County, TW;
Yu-Chih Huang, Hsinchu, TW;
Yu-Feng Chen, Hsinchu, TW;
Kuo-Lung Pan, Hsinchu, TW;
Yu-Jen Cheng, New Taipei, TW;
Mirng-Ji Lii, Hsinchu County, TW;
Han-Ping Pu, Taichung, TW;
Wei-Sen Chang, Kinmen County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a first dielectric over the semiconductor substrate. The semiconductor device also includes a conductive layer disposed in the first dielectric and a second dielectric disposed on the conductive layer. In the semiconductor device, at least a portion of the conductive layer is exposed from the first dielectric and second dielectric. The semiconductor device further includes a conductive trace partially over the second dielectric and in contact with the exposed portion of the conductive layer. In the semiconductor device, the conductive trace is connected to the conductive pad at one end.