The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Sep. 27, 2013
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Nitta Haas Incorporated, Osaka, JP;
Yasuyuki Itai, Kyoto, JP;
Naresh Kumar Penta, Newark, DE (US);
Naoko Kawai, Kyoto, JP;
Hiroyuki Nakano, Kyoto, JP;
Shinichi Haba, Kyoto, JP;
Yoshiharu Ota, Kyoto, JP;
Takayuki Matsushita, Kyoto, JP;
Masashi Teramoto, Kyoto, JP;
Sakiko Nakashima, Kyoto, JP;
Tomoyuki Toda, Kyoto, JP;
Koichi Yoshida, Kyoto, JP;
Lee Melbourne Cook, Atglen, PA (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc, Newark, DE (US);
Nitta Haas Incorporated, Osaka, JP;
Abstract
A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.