The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Aug. 10, 2012
Mill-jer Wang, Hsinchu, TW;
Chewn-pu Jou, Hsinchu, TW;
Ching-nen Peng, Hsinchu, TW;
Huan-neng Chen, Hsinchu, TW;
Hung-chih Lin, Hsinchu, TW;
Kuang Kai Yen, Hsinchu, TW;
Hao Chen, Hsinchu, TW;
Feng Wei Kuo, Hsinchu, TW;
Ming-chieh Liu, Hsinchu, TW;
Tsung-hsiung LI, Hsinchu, TW;
Mill-Jer Wang, Hsinchu, TW;
Chewn-Pu Jou, Hsinchu, TW;
Ching-Nen Peng, Hsinchu, TW;
Huan-Neng Chen, Hsinchu, TW;
Hung-Chih Lin, Hsinchu, TW;
Kuang Kai Yen, Hsinchu, TW;
Hao Chen, Hsinchu, TW;
Feng Wei Kuo, Hsinchu, TW;
Ming-Chieh Liu, Hsinchu, TW;
Tsung-Hsiung Li, Hsinchu, TW;
Abstract
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.