The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Mar. 12, 2013
Kla-tencor Corporation, Milpitas, CA (US);
Ali Salehpour, Saratoga, CA (US);
Jaydeep Sinha, Livermore, CA (US);
Kurt Lindsay Haller, Pleasanton, CA (US);
Pradeep Vukkadala, Fremont, CA (US);
George Kren, Los Altos Hills, CA (US);
Jiayao Zhang, Sunnyvale, CA (US);
Mehdi Vaez-Iravani, Los Gatos, CA (US);
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.