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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8901735 B1

PDFFull Text
Date of Patent:
Dec. 02, 2014

Filed:

Jan. 22, 2014

Connector design for packaging integrated circuits

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chen-Hua Yu, Hsin-Chu, TW;

Ying Ching Shih, Taipei, TW;

Po-Hao Tsai, Zhongli, TW;

Chin-Fu Kao, Taipei, TW;

Cheng-Lin Huang, Hsinchu, TW;

Cheng-Chieh Hsieh, Yongkang, TW;

Kuo-Ching Hsu, Chung-Ho, TW;

Jing-Cheng Lin, Chu Tung Zhen, TW;

Shang-Yun Hou, Jubei, TW;

Shin-Puu Jeng, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater & Matsil, L.L.P.

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 25/04 (2014.01); H01L 25/00 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/10156 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13155 (2013.10); H01L 2224/81193 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05681 (2013.01); H01L 24/16 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13686 (2013.01); H01L 2224/11831 (2013.01); H01L 2224/13082 (2013.01); H01L 24/81 (2013.01); H01L 2924/01327 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/05147 (2013.01); H01L 25/04 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13147 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/10145 (2013.01); H01L 24/13 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/0361 (2013.01); H01L 23/147 (2013.01); H01L 2924/01322 (2013.01); H01L 23/49827 (2013.01); H01L 2224/13578 (2013.01); H01L 2224/05073 (2013.01);
Abstract

A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.

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