Ying Ching Shih

Title: Ying Ching Shih: Innovator in Semiconductor Packaging

Introduction

Ying Ching Shih is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work focuses on innovative manufacturing methods that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents, Ying Ching Shih has developed a manufacturing method for semiconductor packaging. This method includes forming a redistribution layer (RDL) on a carrier, defining an active portion and a dummy portion of the RDL, and placing a semiconductor die over the dummy portion. Additionally, he has created a manufacturing method for a package-on-package (PoP) semiconductor structure. This involves forming a first RDL on a polymer-based layer of a carrier, defining active and dummy portions, and placing a semiconductor die over the dummy portion, with the back side of the die facing the first RDL. A second RDL is then formed over the front side of the semiconductor die, which has at least one contact pad, and a semiconductor package is attached at the back side of the die.

Career Highlights

Ying Ching Shih is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work has been instrumental in advancing semiconductor technology, making him a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including Jing-Cheng Lin and Po-Hao Tsai, contributing to various innovative projects in semiconductor packaging.

Conclusion

Ying Ching Shih's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the field. His innovative methods continue to shape the future of semiconductor technology.