The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Apr. 20, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Cheng-Lin Huang, Hsinchu, TW;
I-Ting Chen, Hsinchu, TW;
Ying Ching Shih, Hsinchu, TW;
Po-Hao Tsai, Zhongli, TW;
Szu Wei Lu, Hsinchu, TW;
Jing-Cheng Lin, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1161 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/145 (2013.01); H01L 2224/1405 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17107 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81897 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01);
Abstract
A semiconductor device includes a substrate having a major surface and conductive bumps distributed over the major surface of the substrate. Each conductive bump of a first subset of the conductive bumps comprises a regular body and a second subset of the conductive bumps comprises a group of separate conductive bumps uniformly distributed around a periphery of a central opening.