The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Jul. 28, 2011
Cheng-lin Huang, Hsinchu, TW;
I-ting Chen, Hsinchu, TW;
Ying Ching Shih, Taipei, TW;
Po-hao Tsai, Zhongli, TW;
Szu Wei LU, Hsinchu, TW;
Jing-cheng Lin, Hsinchu, TW;
Shin-puu Jeng, Hsinchu, TW;
Chen-hua Yu, Hsinchu, TW;
Cheng-Lin Huang, Hsinchu, TW;
I-Ting Chen, Hsinchu, TW;
Ying Ching Shih, Taipei, TW;
Po-Hao Tsai, Zhongli, TW;
Szu Wei Lu, Hsinchu, TW;
Jing-Cheng Lin, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Abstract
A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprises a regular body, and each of a second subset of the conductive bumps comprises a ring-shaped body.