The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Feb. 24, 2012
Ellis Chau, San Jose, CA (US);
Reynaldo CO, Santa Cruz, CA (US);
Roseann Alatorre, San Martin, CA (US);
Philip Damberg, Cupertino, CA (US);
Wei-shun Wang, Palo Alto, CA (US);
SE Young Yang, Cupertino, CA (US);
Zhijun Zhao, San Jose, CA (US);
Ellis Chau, San Jose, CA (US);
Reynaldo Co, Santa Cruz, CA (US);
Roseann Alatorre, San Martin, CA (US);
Philip Damberg, Cupertino, CA (US);
Wei-Shun Wang, Palo Alto, CA (US);
Se Young Yang, Cupertino, CA (US);
Zhijun Zhao, San Jose, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.