The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Feb. 24, 2012
Ellis Chau, San Jose, CA (US);
Reynaldo CO, Santa Cruz, CA (US);
Roseann Alatorre, San Martin, CA (US);
Philip Damberg, Cupertino, CA (US);
Wei-shun Wang, Palo Alto, CA (US);
SE Young Yang, Cupertino, CA (US);
Ellis Chau, San Jose, CA (US);
Reynaldo Co, Santa Cruz, CA (US);
Roseann Alatorre, San Martin, CA (US);
Philip Damberg, Cupertino, CA (US);
Wei-Shun Wang, Palo Alto, CA (US);
Se Young Yang, Cupertino, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.