The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jun. 28, 2006
Taro Ikeda, Nirasaki, JP;
Yasushi Mizusawa, Albany, NY (US);
Tatsuo Hatano, Nirasaki, JP;
Osamu Yokoyama, Nirasaki, JP;
Takashi Sakuma, Nirasaki, JP;
Taro Ikeda, Nirasaki, JP;
Yasushi Mizusawa, Albany, NY (US);
Tatsuo Hatano, Nirasaki, JP;
Osamu Yokoyama, Nirasaki, JP;
Takashi Sakuma, Nirasaki, JP;
Tokyo Electron Limited, Minato-Ku, Tokyo-To, JP;
Abstract
The present invention is a film deposition method of a metal film comprising the steps of: placing an object to be processed having a recess formed in a surface thereof, on a stage in a processing vessel; evacuating the processing vessel to create a vacuum therein; ionizing a metal target in the evacuated processing vessel to generate metal particles including metal ions, by means of a plasma formed by making the plasma from an inert gas; and by applying a bias electric power to the object to be processed placed on the stage to draw the plasma and the metal particles into the object to be processed, scraping a bottom part of the recess to form a scraped recess, and depositing a metal film on an entire surface of the object to be processed including surfaces in the recess and in the scraped recess.