The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
May. 29, 2008
Hong Chen, San Ramon, CA (US);
Michael J. Van Riet, Morgan Hill, CA (US);
Chien-huei (Adam) Chen, San Jose, CA (US);
Jason Z. Lin, Saratoga, CA (US);
Chris Maher, Campbell, CA (US);
Michal Kowalski, Santa Cruz, CA (US);
Barry Becker, San Jose, CA (US);
Stephanie Chen, Fremont, CA (US);
Subramanian Balakrishnan, Cupertino, CA (US);
Suryanarayana Tummala, Andhra Pradesh, IN;
Hong Chen, San Ramon, CA (US);
Michael J. Van Riet, Morgan Hill, CA (US);
Chien-Huei (Adam) Chen, San Jose, CA (US);
Jason Z. Lin, Saratoga, CA (US);
Chris Maher, Campbell, CA (US);
Michal Kowalski, Santa Cruz, CA (US);
Barry Becker, San Jose, CA (US);
Stephanie Chen, Fremont, CA (US);
Subramanian Balakrishnan, Cupertino, CA (US);
Suryanarayana Tummala, Andhra Pradesh, IN;
KLA-Tencor Corp., San Jose, CA (US);
Abstract
Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.