The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Nov. 09, 2005
Hiroyuki Shinada, Chofu, JP;
Mari Nozoe, Ome, JP;
Haruo Yoda, Tokyo, JP;
Kimiaki Ando, Hamura, JP;
Katsuhiro Kuroda, Hachioji, JP;
Yutaka Kaneko, Hachioji, JP;
Maki Tanaka, Yokohama, JP;
Shunji Maeda, Yokohama, JP;
Hitoshi Kubota, Fujisawa, JP;
Aritoshi Sugimoto, Tokyo, JP;
Katsuya Sugiyama, Kashiwa, JP;
Atsuko Takafuji, Tokyo, JP;
Yusuke Yajima, Kodaira, JP;
Hiroshi Tooyama, Hachioji, JP;
Tadao Ino, Hino, JP;
Takashi Hiroi, Yokohama, JP;
Kazushi Yoshimura, Kamakura, JP;
Yasutsugu Usami, Hitachinaka, JP;
Hiroyuki Shinada, Chofu, JP;
Mari Nozoe, Ome, JP;
Haruo Yoda, Tokyo, JP;
Kimiaki Ando, Hamura, JP;
Katsuhiro Kuroda, Hachioji, JP;
Yutaka Kaneko, Hachioji, JP;
Maki Tanaka, Yokohama, JP;
Shunji Maeda, Yokohama, JP;
Hitoshi Kubota, Fujisawa, JP;
Aritoshi Sugimoto, Tokyo, JP;
Katsuya Sugiyama, Kashiwa, JP;
Atsuko Takafuji, Tokyo, JP;
Yusuke Yajima, Kodaira, JP;
Hiroshi Tooyama, Hachioji, JP;
Tadao Ino, Hino, JP;
Takashi Hiroi, Yokohama, JP;
Kazushi Yoshimura, Kamakura, JP;
Yasutsugu Usami, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.