The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Jul. 10, 2002
Applicants:

Tetsuji Togawa, Kanagawa, JP;

Ikutaro Noji, Kanagawa, JP;

Keisuke Namiki, Kanagawa, JP;

Hozumi Yasuda, Kanagawa, JP;

Shunichiro Kojima, Kanagawa, JP;

Kunihiko Sakurai, Kanagawa, JP;

Nobuyuki Takada, Kanagawa, JP;

Osamu Nabeya, Kanagawa, JP;

Makoto Fukushima, Kanagawa, JP;

Hideki Takayanagi, Tokyo, JP;

Inventors:

Tetsuji Togawa, Kanagawa, JP;

Ikutaro Noji, Kanagawa, JP;

Keisuke Namiki, Kanagawa, JP;

Hozumi Yasuda, Kanagawa, JP;

Shunichiro Kojima, Kanagawa, JP;

Kunihiko Sakurai, Kanagawa, JP;

Nobuyuki Takada, Kanagawa, JP;

Osamu Nabeya, Kanagawa, JP;

Makoto Fukushima, Kanagawa, JP;

Hideki Takayanagi, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01); B24B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.


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