Tokyo, Japan

Hideki Takayanagi


 

Average Co-Inventor Count = 7.0

ph-index = 4

Forward Citations = 45(Granted Patents)


Company Filing History:


Years Active: 2005-2023

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8 patents (USPTO):

Title: Innovations of Hideki Takayanagi

Introduction

Hideki Takayanagi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the area of substrate processing and measurement devices. With a total of eight patents to his name, Takayanagi continues to push the boundaries of innovation.

Latest Patents

Among his latest patents are several groundbreaking inventions. One notable patent is a device for measuring bump height, which allows for simple measurement of a bump height. This device includes a light sensor that irradiates a substrate and detects reflected light to calculate the height of the bump relative to the seed layer. Another important patent is related to a substrate holder and plating apparatus, which features a unique design for holding substrates securely while processing.

Career Highlights

Takayanagi's career is marked by his work at Ebara Corporation, where he has been instrumental in developing advanced technologies. His expertise in measurement devices and substrate processing has made him a valuable asset to the company. His innovative spirit and dedication to research have led to numerous advancements in the field.

Collaborations

Throughout his career, Takayanagi has collaborated with notable colleagues, including Tetsuji Togawa and Ikutaro Noji. These collaborations have fostered a creative environment that has resulted in several successful projects and patents.

Conclusion

Hideki Takayanagi's contributions to technology through his patents and innovations have made a significant impact in his field. His work continues to inspire future advancements in substrate processing and measurement devices.

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