The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2006

Filed:

Sep. 30, 2004
Applicants:

Patrick Huet, San Jose, CA (US);

Maruti Shanbhag, Bangalore, IN;

Sandeep Bhagwat, Milpitas, CA (US);

Michal Kowalski, Santa Cruz, CA (US);

Vivekanand Kini, Sunnyvale, CA (US);

David Randall, Sunnyvale, CA (US);

Sharon Mccauley, San Jose, CA (US);

Tong Huang, Sunnyvale, CA (US);

Jianxin Zhang, Santa Clara, CA (US);

Kenong Wu, Davis, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Ariel Tribble, Fremont, CA (US);

Ashok Kulkarni, San Jose, CA (US);

Cecelia Anne Campochiaro, Sunnyvale, CA (US);

Inventors:

Patrick Huet, San Jose, CA (US);

Maruti Shanbhag, Bangalore, IN;

Sandeep Bhagwat, Milpitas, CA (US);

Michal Kowalski, Santa Cruz, CA (US);

Vivekanand Kini, Sunnyvale, CA (US);

David Randall, Sunnyvale, CA (US);

Sharon McCauley, San Jose, CA (US);

Tong Huang, Sunnyvale, CA (US);

Jianxin Zhang, Santa Clara, CA (US);

Kenong Wu, Davis, CA (US);

Lisheng Gao, Morgan Hill, CA (US);

Ariel Tribble, Fremont, CA (US);

Ashok Kulkarni, San Jose, CA (US);

Cecelia Anne Campochiaro, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Technologies Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.


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