The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
Mar. 14, 1996
Minori Noguchi, Yokohama, JP;
Yukio Kembo, Yokohama, JP;
Hiroshi Morioka, Ebina, JP;
Hidetoshi Nishiyama, Fujisawa, JP;
Hideaki Doi, Oota-ku, JP;
Masataka Shiba, Yokohama, JP;
Yoshiharu Shigyo, Takasaki, JP;
Kazuhiko Matsuoka, Tano-gun, JP;
Kenji Watanabe, Oume, JP;
Yoshimasa Ohshima, Yokohama, JP;
Fumiaki Endo, Kodaira, JP;
Yuzo Taniguchi, Kodaira, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.