The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Feb. 21, 2001
Patrick W. Tandy, Boise, ID (US);
Joseph M. Brand, Boise, ID (US);
Brad D. Rumsey, Meridian, ID (US);
Steven R. Stephenson, Nampa, ID (US);
David J. Corisis, Meridian, ID (US);
Todd O. Bolken, Meridian, ID (US);
Edward A. Schrock, Boise, ID (US);
Brenton L. Dickey, Meridian, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.