Joseph M Brand

This inventor holds 26 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Other. Active years: 1977-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph M Brand. Retrieved from https://idiyas.com/inventor/joseph-m-brand

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 88.5

Average Co-Inventor Count = 1.3

ph-index = 9

Forward Citations = 291(Granted Patents)

Location History:

Ardmore, PA (US) (1977)
Boise, ID (US) (1999 - 2020)

Company Filing History:

25 out of 39,253

Micron Technology Incorporated

patents

1 out of 834,570

Other

patents

Years Active: 1977-2020

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Areas of Expertise:

Semiconductor Devices

Microelectronic Packaging

Integrated Circuits

Encapsulation Methods

Heat Sink Assemblies

Dynamic Random Access Memory

Packaging Encapsulants

Electronic Packages

Stress Processing

Circuit Adhering Methods

Manufacturing Techniques

Device Structures

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10679967 - Systems enabling lower-stress processing of semiconductor device structures and related structures (2020-06-09),

2. 10403598 - Methods and system for processing semiconductor device structures (2019-09-03),

3. 7405487 - Method and apparatus for removing encapsulating material from a packaged microelectronic device (2008-07-29),

4. 7306974 - Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies (2007-12-11),

5. 7273769 - Method and apparatus for removing encapsulating material from a packaged microelectronic device (2007-09-25),

6. 7067905 - Packaged microelectronic devices including first and second casings (2006-06-27),

7. 6949838 - Integrated circuit device (2005-09-27),

8. 6908795 - Method of fabricating an encapsulant lock feature in integrated circuit packaging (2005-06-21),

9. 6812068 - Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages (2004-11-02),

10. 6706565 - Methods of forming an integrated circuit device (2004-03-16),

11. 6706560 - Method of forming heat sink and semiconductor chip assemblies (2004-03-16),

12. 6528890 - Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit (2003-03-04),

13. 6521980 - Controlling packaging encapsulant leakage (2003-02-18),

14. 6498052 - Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit (2002-12-24),

15. 6461894 - Methods of forming a circuit and methods of preparing an integrated circuit (2002-10-08),

Title: Joseph M. Brand: A Pioneer in Semiconductor Innovations

Introduction

Joseph M. Brand, based in Boise, ID, is a prominent inventor with an impressive portfolio comprising 25 patents. His contributions to the field of semiconductor technology have significantly advanced the processing and assembly of semiconductor devices.

Latest Patents

Among his most recent innovations, Brand has developed systems that facilitate lower-stress processing of semiconductor device structures. These groundbreaking patents include designs for semiconductor device assemblies that integrate a carrier wafer with a thermoset adhesive and a metal barrier material. The innovative approach allows a laser apparatus to effectively process these wafers, showcasing a sophisticated method of enhancing device performance and reliability. His additional patent details how to detach semiconductor device structures through effective laser application, streamlining the manufacturing process and reducing potential damage to the components.

Career Highlights

Joseph M. Brand is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His impactful work there has positioned him as a key player in the development of advanced semiconductor processing technologies. His vast experience and innovative mindset have led to significant advancements that benefit both the company and the broader technology sector.

Collaborations

Throughout his career, Joseph has collaborated with talented individuals such as Patrick W. Tandy and Brad D. Rumsey. These partnerships have been instrumental in pushing the boundaries of semiconductor technology, allowing for a dynamic exchange of ideas and expertise.

Conclusion

Joseph M. Brand's work exemplifies the forefront of semiconductor innovation. With a strong track record of patents and collaborations, his contributions continue to significantly influence the industry. As advancements in technology evolve, Brand's innovations will likely play a crucial role in shaping the future of semiconductor device manufacturing.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]