The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Jan. 10, 2019
Micron Technology, Inc., Boise, ID (US);
Andrew M. Bayless, Boise, ID (US);
Joseph M. Brand, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Semiconductor device assemblies may include a carrier wafer and a thermoset adhesive on a surface of the carrier wafer. A metal barrier material may be located on the thermoset adhesive. A thermoplastic adhesive may be located on an opposite side of the metal barrier material from the thermoset adhesive. A device wafer may be located on an opposite side of the thermoplastic material from the metal barrier material. Semiconductor device processing systems may include a carrier wafer having a thermoset adhesive adhered to a surface thereof and a metal barrier material adhered to the thermoset adhesive opposite the carrier wafer. A laser apparatus may be located on an opposite side of the carrier wafer from the metal barrier material and positioned to aim a laser beam through the carrier wafer to impinge on the metal barrier material.