Edward A Schrock

This inventor holds 20 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 1999-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Edward A Schrock. Retrieved from https://idiyas.com/inventor/edward-a-schrock

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 85.0

Average Co-Inventor Count = 2.2

ph-index = 12

Forward Citations = 635(Granted Patents)

Company Filing History:

20 out of 39,253

Micron Technology Incorporated

patents

Years Active: 1999-2007

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Areas of Expertise:

Flexible Substrate

BGA Package

Adhesive Composition

Z-Axis Electrical Contact

Composite Interposer

Electrical Conductor System

Packaging Applications

Encapsulant Leakage

Microelectronic Devices

Die Attach

Multi-Layered Adhesive

Fabrication Methods

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7213331 - Method for forming stencil (2007-05-08),

2. 7071030 - Method of making a flexible substrate with a filler material (2006-07-04),

3. 6825569 - BGA package having substrate with patterned solder mask defining open die attach area (2004-11-30),

4. 6770981 - Composite interposer for BGA packages (2004-08-03),

5. 6770164 - Method for attaching a semiconductor die to a substrate (2004-08-03),

6. 6710456 - Composite interposer for BGA packages (2004-03-23),

7. 6709896 - Methods for use in packaging applications using an adhesive composition (2004-03-23),

8. 6707152 - Semiconductor device, electrical conductor system, and method of making (2004-03-16),

9. 6699928 - Adhesive composition for use in packaging applications (2004-03-02),

10. 6662440 - Z-axis electrical contact for microelectric devices (2003-12-16),

11. 6646354 - Adhesive composition and methods for use in packaging applications (2003-11-11),

12. 6616864 - Z-axis electrical contact for microelectronic devices (2003-09-09),

13. 6541872 - Multi-layered adhesive for attaching a semiconductor die to a substrate (2003-04-01),

14. 6521980 - Controlling packaging encapsulant leakage (2003-02-18),

15. 6395579 - Controlling packaging encapsulant leakage (2002-05-28),

Title: The Innovative Journey of Edward A. Schrock

Introduction: Edward A. Schrock, a pioneering inventor based in Boise, ID, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Edward A. Schrock holds several patents in various technological domains, showcasing his versatility and ingenuity in creating novel solutions to complex problems.

Career Highlights: Throughout his illustrious career, Edward A. Schrock has been at the forefront of innovation, consistently pushing the boundaries of what is possible in the realm of technology. His dedication to research and development has led to the creation of cutting-edge products that have revolutionized industries.

Collaborations: Edward A. Schrock has collaborated with leading research institutions, universities, and companies to further his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Edward A. Schrock stands as a shining example of an inventor whose passion for innovation has driven him to create groundbreaking technologies that have had a lasting impact on society. His relentless pursuit of excellence and commitment to pushing the boundaries of what is possible make him a true visionary in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]