The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2002
Filed:
Sep. 15, 2000
Kunihiko Sakurai, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Nobuyuki Takada, Tokyo, JP;
Satoshi Wakabayashi, Tokyo, JP;
Kenichiro Saito, Tokyo, JP;
Masahiko Sekimoto, Tokyo, JP;
Takuji Hayama, Tokyo, JP;
Daisuke Koga, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.