The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 1996
Filed:
Feb. 14, 1994
Ernest R Nolan, Round Rock, TX (US);
Diana C Duane, Cedar Park, TX (US);
Todd H Herder, Corvallis, OR (US);
Thomas A Bishop, Austin, TX (US);
Kimcuc T Tran, Austin, TX (US);
Robert W Froehlich, Austin, TX (US);
Randy L German, Austin, TX (US);
Richard D Nelson, Austin, TX (US);
Chung J Lee, Austin, TX (US);
Mark R Breen, Austin, TX (US);
Kathryn V Keswick, Austin, TX (US);
Microelectronics and Computer Technology Corporation, Austin, TX (US);
Abstract
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.