Diana C Duane

Title: Diana C Duane: Innovator in Circuit Technology

Introduction

Diana C Duane is a prominent inventor based in Cedar Park, TX (US). She has made significant contributions to the field of circuit technology, holding 2 patents that showcase her innovative spirit and technical expertise.

Latest Patents

Her latest patents include "Compliant electrically connective bumps for an adhesive flip chip" and "Copper/epoxy structures." The first patent focuses on various methods for forming polymer bumps on a substrate or an integrated circuit die. This process involves coating a polymer material on a substrate, curing the polymer, and etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal, such as gold, on the polymer bump. The second patent describes a high-density, high-performance circuit fabricated with a copper/epoxy structure, which is well-suited for integrated circuit interconnect devices. Fluorene-containing epoxy resins are utilized to achieve certain material and processing advantages over traditional copper/polyimide structures.

Career Highlights

Diana has worked with notable companies, including Microelectronics and Computer Technology Corporation and Minnesota Mining and Manufacturing Company. Her experience in these organizations has allowed her to develop and refine her innovative ideas in circuit technology.

Collaborations

Diana has collaborated with esteemed colleagues such as Ernest R Nolan and Todd H Herder, contributing to the advancement of technology in her field.

Conclusion

Diana C Duane's contributions to circuit technology through her patents and collaborations highlight her role as a significant innovator in the industry. Her work continues to influence advancements in integrated circuit design and manufacturing.