Microelectronics and Computer Technology Corporation

Minnesota Mining and Manufacturing Company

Diana C Duane

Richard D Nelson

Robert W Froehlich

Thomas Alan Bishop

Chung J Lee

Ernest R Nolan

Robert C Jordan

Mark R Breen

Randy L German

Kimcuc T Tran

Eric L Zilley

Kathryn V Keswick

Todd H Herder

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Compliant electrically connective bumps for an adhesive flip chip

A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

Copper/epoxy structures

Growing community of inventors

Cedar Park, TX, United States of America

Diana C Duane