Todd H Herder

Title: Todd H. Herder: Innovator in Microelectronics

Introduction

Todd H. Herder is a notable inventor based in Corvallis, Oregon. He has made significant contributions to the field of microelectronics, particularly in the development of innovative technologies for integrated circuit devices. His work has led to advancements that enhance the performance and reliability of electronic components.

Latest Patents

Todd H. Herder holds a patent for "Compliant electrically connective bumps for an adhesive flip chip." This invention involves compliant electrically connection bumps for an adhesive flip chip integrated circuit device. The methods for forming these bumps include steps such as forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming process includes coating a polymer material on a substrate, curing the polymer, and etching the bump pattern from the polymer material. The overcoating step involves electrolessly plating a ductile metal, such as gold, on the polymer bump. He has 1 patent to his name.

Career Highlights

Todd H. Herder has worked with the Microelectronics and Computer Technology Corporation, where he has applied his expertise in microelectronics to develop cutting-edge technologies. His contributions have been instrumental in advancing the capabilities of electronic devices.

Collaborations

Throughout his career, Todd has collaborated with notable colleagues, including Ernest R. Nolan and Diana C. Duane. These partnerships have fostered innovation and have led to the successful development of various technologies in the field.

Conclusion

Todd H. Herder is a distinguished inventor whose work in microelectronics has made a lasting impact on the industry. His innovative patent for compliant electrically connective bumps exemplifies his commitment to advancing technology. His collaborations and career achievements further highlight his significant contributions to the field.