Kimcuc T Tran

Title: Innovations by Kimcuc T Tran

Introduction

Kimcuc T Tran is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of microelectronics, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include "Compliant electrically connective bumps for an adhesive flip chip" and "Method for producing conductive patterns." The first patent focuses on various methods for forming polymer bumps on a substrate or an integrated circuit die. This process involves coating a polymer material on a substrate, curing the polymer, and etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal, such as gold, on the polymer bump. The second patent provides an apparatus and methods for transferring conductive patterns onto substrates under conditions of heat and pressure. This apparatus comprises a master mold with a printing surface that produces a permanent mirror image of the conductive pattern to be created.

Career Highlights

Kimcuc T Tran is associated with the Microelectronics and Computer Technology Corporation, where he has been able to apply his innovative ideas in a collaborative environment. His work has contributed to advancements in microelectronics and has had a positive impact on the industry.

Collaborations

He has worked alongside notable colleagues such as Chung J Lee and Ernest R Nolan, further enhancing the collaborative spirit within his field.

Conclusion

Kimcuc T Tran's contributions to microelectronics through his patents and collaborative efforts highlight his role as an influential inventor. His work continues to inspire advancements in technology and innovation.