Microelectronics and Computer Technology Corporation

Kimcuc T Tran

Chung J Lee

Richard D Nelson

Charles W Lin

Thomas Alan Bishop

Robert W Froehlich

Tom J Hirsch

Ernest R Nolan

Mark R Breen

Randy L German

Diana C Duane

Kathryn V Keswick

Todd H Herder

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Compliant electrically connective bumps for an adhesive flip chip

The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.

Method for producing conductive patterns

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Austin, TX, United States of America

Kimcuc T Tran