Company Filing History:
3 out of 192 
2 out of 21 Years Active: 1993-1998
Title: Innovations of Chung J Lee in Photosensitive Materials
Introduction
Chung J Lee is a notable inventor based in Austin, TX, who has made significant contributions to the field of electronic packaging applications. With a total of five patents to his name, Lee's work focuses on the development of advanced photosensitive materials that enhance various technological applications.
Latest Patents
One of Lee's latest patents involves the synthesis of photosensitive polyimide (Ps-PIM) materials designed for electronic packaging applications. These materials belong to three distinct families of Ps-PIM, utilizing precursors to create various catalytic compositions with differing photosensitivities. The resulting Ps-PIM materials exhibit increased photosensitivities at wavelengths longer than approximately 330 to 350 nm, along with a catalytic system that remains insensitive to oxygen. This innovation has improved applications in holographic systems. Another significant patent by Lee presents novel photosensitive polymer films that include a polymer carrier with specific chemical groups, an initiation system for photo polymerization, polymerizable compounds, and other necessary chemicals. These films demonstrate remarkable performance with short pump times, short DRAW times, and reduced noise levels, achieving noise levels that are one-third to one-fifth of those found in previous photosensitive polymer films.
Career Highlights
Throughout his career, Chung J Lee has worked with prominent organizations such as Microelectronics and Computer Technology Corporation and Tamarack Storage Devices. His experience in these companies has contributed to his expertise in the field of electronic materials.
Collaborations
Lee has collaborated with notable colleagues, including Kimcuc T Tran and Charles W Lin, further enhancing his innovative work in photosensitive materials.
Conclusion
Chung J Lee's contributions to the development of photosensitive materials have significantly advanced the field of electronic packaging applications. His innovative patents and collaborations reflect his dedication to enhancing technology through his inventions.
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