The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Sep. 06, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Glenn Glass, Portland, OR (US);

Anand Murthy, Portland, OR (US);

Biswajeet Guha, Hillsboro, OR (US);

Dax Crum, Beaverton, OR (US);

Patrick Keys, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Susmita Ghose, Hillsboro, OR (US);

Ted Cook, Jr., Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01); H10D 62/822 (2025.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 21/683 (2006.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01);
U.S. Cl.
CPC ...
H10D 62/121 (2025.01); H01L 21/02532 (2013.01); H01L 21/02603 (2013.01); H01L 21/26513 (2013.01); H01L 21/30604 (2013.01); H01L 21/3081 (2013.01); H10D 30/024 (2025.01); H10D 30/62 (2025.01); H10D 30/6735 (2025.01); H10D 62/151 (2025.01); H10D 62/292 (2025.01); H10D 62/822 (2025.01); H01L 21/0276 (2013.01); H01L 21/30625 (2013.01); H01L 21/32134 (2013.01); H01L 21/32135 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H10D 64/017 (2025.01); H10D 84/0193 (2025.01); H10D 84/038 (2025.01); H10D 84/853 (2025.01);
Abstract

Gate-all-around integrated circuit structures having underlying dopant-diffusion blocking layers are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin. The fin includes a dopant diffusion blocking layer on a first semiconductor layer, and a second semiconductor layer on the dopant diffusion blocking layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.


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