The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jul. 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Kuan-Yu Huang, Taipei, TW;
Chih-Wei Wu, Yilan County, TW;
Sung-Hui Huang, Yilan County, TW;
Shang-Yun Hou, Hsinchu, TW;
Ying-Ching Shih, Hsinchu, TW;
Cheng-Chieh Li, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes first and second package components stacked upon and electrically connected to each other, and first and second joint structures. The first package component includes first and second conductive bumps, the second package component includes third and fourth conductive bumps having dimensions greater than those of the first and second conductive bumps. The first joint structure partially covers the first and third conductive bumps. The second joint structure partially covers the second and the fourth conductive bumps. A first angle between a sidewall of the first conductive bump and a tangent line at an end point of a boundary of the first joint structure on the first conductive bump is greater than a second angle between a sidewall of the second conductive bump and a tangent line at an end point of a boundary of the second joint structure on the second conductive bump.