Hsinchu, Taiwan

Cheng-Chieh Li

USPTO Granted Patents = 5 

Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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5 patents (USPTO):

Title: Innovations by Cheng-Chieh Li in Semiconductor Packaging

Introduction

Cheng-Chieh Li is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of five patents. His work focuses on improving the efficiency and effectiveness of semiconductor packages, which are crucial components in modern electronics.

Latest Patents

One of Cheng-Chieh Li's latest patents is titled "Joint structure in semiconductor package and manufacturing method thereof." This patent describes a method of forming a semiconductor package that includes creating a first package component with conductive bumps and a second package component with larger conductive bumps. The innovative design ensures that the angles between the sidewalls of the conductive bumps and the joint structures are optimized for better performance. Another patent under the same title outlines a semiconductor package that features stacked components with joint structures that enhance electrical connections and stability.

Career Highlights

Cheng-Chieh Li works at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a key player in the development of advanced technologies that drive the electronics market forward.

Collaborations

Cheng-Chieh Li collaborates with talented colleagues such as Chih-Wei Wu and Ying-Ching Shih. Together, they contribute to innovative projects that push the boundaries of semiconductor technology.

Conclusion

Cheng-Chieh Li's work in semiconductor packaging exemplifies the importance of innovation in technology. His patents reflect a commitment to enhancing the functionality and reliability of electronic components. Through his contributions, he continues to shape the future of the semiconductor industry.

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