The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
May. 02, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Richard E. Schenker, Portland, OR (US);
Robert L. Bristol, Portland, OR (US);
Kevin L. Lin, Beaverton, OR (US);
Florian Gstrein, Portland, OR (US);
James M. Blackwell, Portland, OR (US);
Marie Krysak, Portland, OR (US);
Manish Chandhok, Beaverton, OR (US);
Paul A. Nyhus, Portland, OR (US);
Charles H. Wallace, Portland, OR (US);
Curtis W. Ward, Hillsboro, OR (US);
Swaminathan Sivakumar, Beaverton, OR (US);
Elliot N. Tan, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 27/0886 (2013.01); H01L 29/7848 (2013.01);
Abstract
Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.