logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11768338 B1

PDFFull Text
Date of Patent:
Sep. 26, 2023

Filed:

May. 27, 2021

Optical interconnect structure, package structure and fabricating method thereof

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Ming Weng, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Hao-Yi Tsai, Hsinchu, TW;

Cheng-Chieh Hsieh, Tainan, TW;

Hung-Yi Kuo, Taipei, TW;

Tsung-Yuan Yu, Taipei, TW;

Hua-Kuei Lin, Hsinchu, TW;

Yu-Hsiang Hu, Hsinchu, TW;

Chewn-Pu Jou, Hsinchu, TW;

Feng-Wei Kuo, Hsinchu County, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Michelle R Connelly

Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/136 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4214 (2013.01); G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/136 (2013.01); G02B 6/4203 (2013.01); G02B 6/4204 (2013.01); G02B 6/43 (2013.01); G02B 6/428 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12104 (2013.01);
Abstract

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

Find Patent Forward Citations

Weng, Chung-Ming. (2023). Optical interconnect structure, package structure and fabricating method thereof (U.S. Patent No. 11768338). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11768338

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…