The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Mar. 30, 2021
Applicant:

Cmc Materials, Inc., Aurora, IL (US);

Inventors:

Alexander W. Hains, Aurora, IL (US);

Kim Long, Naperville, IL (US);

Steven Grumbine, Aurora, IL (US);

Roman A. Ivanov, Aurora, IL (US);

Kevin P. Dockery, Aurora, IL (US);

Benjamin Petro, St. Charles, IL (US);

Brian Sneed, Vernon Hills, IL (US);

Galyna Krylova, Naperville, IL (US);

Assignee:

CMC MATERIALS, INC., Aurora, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01); C23F 1/26 (2006.01); C23F 11/04 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C23F 1/26 (2013.01); C23F 11/04 (2013.01); H01L 21/3212 (2013.01);
Abstract

A chemical mechanical polishing composition includes a liquid carrier and colloidal silica particles dispersed in the liquid carrier. The colloidal silica particles have a positive charge of at least 10 mV in the liquid carrier and may be characterized as having: (i) a number average aspect ratio of greater than about 1.25 and (ii) a normalized particle size span by weight of greater than about 0.42. The polishing composition may further optionally include an iron-containing accelerator and a tungsten etch inhibitor, for example, when the polishing composition is a tungsten CMP composition.


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