Company Filing History:
Years Active: 2023
Title: Galyna Krylova: Innovator in Chemical Mechanical Polishing
Introduction
Galyna Krylova is a notable inventor based in Naperville, IL (US). She has made significant contributions to the field of chemical mechanical polishing (CMP) through her innovative work. Her expertise and dedication have led to the development of advanced polishing compositions that enhance the efficiency of semiconductor manufacturing.
Latest Patents
Galyna holds 1 patent for her invention titled "CMP composition including a novel abrasive." This patent describes a chemical mechanical polishing composition that includes a liquid carrier and colloidal silica particles. The colloidal silica particles possess a positive charge of at least 10 mV in the liquid carrier. They are characterized by a number average aspect ratio of greater than about 1.25 and a normalized particle size span by weight of greater than about 0.42. The composition may also include an iron-containing accelerator and a tungsten etch inhibitor, particularly when used as a tungsten CMP composition.
Career Highlights
Galyna Krylova is currently employed at CMC Materials, Inc., where she continues to innovate in the field of CMP technologies. Her work has been instrumental in advancing the capabilities of polishing compositions used in semiconductor fabrication.
Collaborations
Throughout her career, Galyna has collaborated with talented professionals, including Alexander W. Hains and Kim Long. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Galyna Krylova's contributions to the field of chemical mechanical polishing exemplify her commitment to innovation and excellence. Her patented work continues to influence the semiconductor industry, showcasing her role as a leading inventor in this specialized area.