The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Apr. 15, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Haosheng Wu, San Jose, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Jianshe Tang, San Jose, CA (US);

Chih Chung, San Jose, CA (US);

Hui Chen, San Jose, CA (US);

Hari Soundararajan, Sunnyvale, CA (US);

Benjamin Cherian, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 57/02 (2006.01); H01L 21/304 (2006.01); B24B 37/04 (2012.01); B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01); B24B 53/017 (2012.01); B24B 49/14 (2006.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 37/22 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); H01L 21/304 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01);
Abstract

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.


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