Chih Chung

Title: Innovations of Chih Chung in Chemical Mechanical Polishing

Introduction

Chih Chung is a notable inventor based in San Jose, CA. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of polishing processes in semiconductor manufacturing.

Latest Patents

Chih Chung holds a patent titled "Temperature-based asymmetry correction during CMP and nozzle for media dispensing." This invention involves a chemical mechanical polishing apparatus that features a rotatable platen to hold a polishing pad and a carrier to hold a substrate against the polishing surface. The apparatus includes a polishing liquid supply port, a thermal control system with a movable nozzle, and a controller that coordinates the dispensing of the medium with the nozzle's motion across the polishing surface. This innovation aims to improve temperature control during the polishing process, thereby enhancing the quality of the final product.

Career Highlights

Chih Chung is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has allowed him to apply his expertise in CMP technologies and contribute to advancements in the field.

Collaborations

Chih Chung has collaborated with notable colleagues, including Haosheng Wu and Shou-Sung Chang. These collaborations have fostered a productive environment for innovation and development in CMP technologies.

Conclusion

Chih Chung's contributions to the field of chemical mechanical polishing through his innovative patent demonstrate his commitment to advancing semiconductor manufacturing processes. His work continues to influence the industry positively.