Applied Materials, Inc.

Chih Chung

Shou-Sung Chang

Jianshe Tang

Benjamin Cherian

Hui W Chen

Haosheng Wu

Hari N Soundararajan

A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

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San Jose, CA, United States of America

Chih Chung