The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Oct. 31, 2019
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Roman Kris, Jerusalem, IL;

Roi Meir, Ganei Tikva, IL;

Sahar Levin, Or-Yehuda, IL;

Ishai Schwarzband, Or-Yehuda, IL;

Grigory Klebanov, Rishon-LeZion, IL;

Shimon Levi, Kiryat-Tivon, IL;

Efrat Noifeld, Nes Ziona, IL;

Hiroshi Miroku, Mie, JP;

Taku Yoshizawa, Mie, JP;

Kasturi Saha, Bangalore, IN;

Sharon Duvdevani-Bar, Mazkeret-Batya, IL;

Vadim Vereschagin, Ashdod, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/13 (2017.01); G06T 7/194 (2017.01); G06T 7/60 (2017.01); G06V 10/44 (2022.01); G06V 20/69 (2022.01); G01N 23/225 (2018.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 23/225 (2013.01); G06T 7/13 (2017.01); G06T 7/194 (2017.01); G06T 7/60 (2013.01); G06V 10/44 (2022.01); G06V 20/695 (2022.01); G01N 2223/401 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A method for process control of a semiconductor structure fabricated by a series of fabrication steps, the method comprising obtaining an image of the semiconductor structure indicative of at least two individual fabrication steps; wherein the image is generated by scanning the semiconductor structure with a charged particle beam and collecting signals emanating from the semiconductor structure; and processing, by a hardware processor, the image to determining a parameter of the semiconductor structure, wherein processing includes measuring step/s from among the fabrication steps as an individual feature.


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