The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Apr. 30, 2021
Applicant:

Kla Corporation, Milpitas, CA (US);

Inventors:

Hong Chen, San Ramon, CA (US);

Kenong Wu, Davis, CA (US);

Xiaochun Li, San Jose, CA (US);

James A. Smith, Los Altos, CA (US);

Eugene Shifrin, Sunnyvale, CA (US);

Qing Luo, Fremont, CA (US);

Michael Cook, Windsor, GB;

Wei Si, Shanghai, CN;

Leon Yu, Shanghai, CN;

Bjorn Brauer, Beaverton, OR (US);

Nurmohammed Patwary, San Jose, CA (US);

Ramon Ynzunza, Milpitas, CA (US);

Neil Troy, San Jose, CA (US);

Assignee:

KLA Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 2021/8864 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) configured for performing at least one repeater defect detection step in front-end processing during an inspection process performed on a wafer having features printed in a lithography process using a reticle. The at least one repeater defect detection step performed in the front-end processing includes identifying any defects detected at corresponding locations in two or more test images by double detection and any defects detected by stacked defect detection as first repeater defect candidates. One or more additional repeater defect detections may be performed on the first repeater defect candidates to generate final repeater defect candidates and identify defects on the reticle from the final repeater defect candidates.


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