The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jul. 09, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Mao-Yen Chang, Kaohsiung, TW;
Chih-Wei Lin, Hsinchu County, TW;
Hao-Yi Tsai, Hsinchu, TW;
Kuo-Lung Pan, Hsinchu, TW;
Chun-Cheng Lin, New Taipei, TW;
Tin-Hao Kuo, Hsinchu, TW;
Yu-Chia Lai, Miaoli County, TW;
Chih-Hsuan Tai, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Provided is a package structure including a composite wafer, a plurality of dies, an underfill, and a plurality of dam structures. The composite wafer has a first surface and a second surface opposite to each other. The composite wafer includes a plurality of seal rings dividing the composite wafer into a plurality of packages; and a plurality of through holes respectively disposed between the seal rings and penetrating through the first and second surfaces. The dies are respectively bonded onto the packages at the first surface by a plurality of connectors. The underfill laterally encapsulates the connectors. The dam structures are disposed on the first surface of the composite wafer to separate the underfill from the through holes.